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Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN General Description The AA4003 is a Class AB stereo Audio Power Amplifier which can deliver 2.0W into 4 speakers with limitation of THD+N less than 1%. The chip is designed specially for Portable DVD player, Portable Media Player, LCD monitor and Digital Photo Frame applications. AA4003 is available in package of SOIC-16 and TSSOP-20 (EDP). AA4003 Features * Output Power, BTL: 2.0W/CH (4, THD+N1%) SE: 160mW/CH (16, THD+N1%) Supply Voltage Range: 2.7V to 5.5V External Feedback Loop for Flexible Gain Set-up Low Power Consumption at Shutdown Mode 0.7A Typical SE, BTL Mode Switchable Optimized Click/POP Noise Suppression Thermal Shutdown Protection * * * * * * Applications * * * * Portable DVD Player Portable Media Player LCD Monitor Digital Photo Frame SOIC-16 TSSOP-20 (EDP) Figure 1. Packages Type of AA4003 Oct. 2007 Rev. 1. 1 1 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Pin Configuration G Package (TSSOP-20 (EDP)) AA4003 SHUTDOWN GND OUTL+ VDD OUTLLINGND LIN+ PGND PGND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 HP-SENSE GND OUTR+ VDD OUTRRINBYPASS RIN+ PGND PGND M Package (SOIC-16) SHUTDOWN GND OUTL+ VDD OUTLLINGND LIN+ 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 HP-SENSE GND OUTR+ VDD OUTRRINBYPASS RIN+ Figure 2. Pin Configurations of AA4003 (Top View) Oct. 2007 Rev. 1. 1 2 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Pin Description Pin Number G Package 1 2, 7, 19 3 4, 17 5 6 8 9, 10, 11, 12 13 14 15 16 18 20 9 10 11 12 14 16 M Package 1 2, 7, 15 3 4, 13 5 6 8 SHUTDOWN GND OUTL+ VDD OUTLLINLIN+ PGND RIN+ BYPASS RINOUTROUTR+ HP-SENSE Shutdown mode enable pin, active High Signal ground Left channel positive output Power supply pin Left channel negative output Left channel negative input Left channel positive input Power ground, used for thermal release Right channel positive input Internal reference voltage pin, connect a 1.0F capacitor to GND Right channel negative input Right channel negative output Right channel positive output SE, BTL Mode switch pin, L - BTL Mode H - SE Mode Pin Name Function AA4003 Oct. 2007 Rev. 1. 1 3 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Ordering Information AA4003 Circuit Type Package E1: Lead Free TR: Tape and Reel Blank: Tube AA4003 G: TSSOP-20 (EDP) M: SOIC-16 Package TSSOP-20 (EDP) SOIC-16 Temperature Range Part Number AA4003G-E1 AA4003GTR-E1 AA4003M-E1 AA4003MTR-E1 Marking ID AA4003G-E1 AA4003G-E1 AA4003M-E1 AA4003M-E1 Packing Type Tube Tape & Reel Tube Tape & Reel -40 to 85 -40 to 85 BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Oct. 2007 Rev. 1. 1 4 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Absolute Maximum Ratings (Note 1) Parameter Supply Voltage Input Voltage Power Dissipation Package Thermal Resistance Operating Junction Temperature Storage Temperature Range Lead Temperature 1.6mm from Case for 10 Seconds ESD (Human Body Model) ESD (Machine Model) Symbol VDD VIN PD RJA G Package TJ TSTG TLEAD 150 -65 to 150 260 2000 300 50 (Note 2) oC oC oC AA4003 Value 6 -0.3 to VDD + 0.3 Internally limited M Package 90 Unit V V oC/W V V Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operation is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: Chip is soldered to 200mm2 copper (top side solder mask) of 1oz. on PCB with 8 x 0.5mm vias.. Recommended Operating Conditions Parameter Supply Voltage Operating Ambient Temperature Symbol VDD TA Min 2.7 -40 Max 5.5 85 Unit V oC Oct. 2007 Rev. 1. 1 5 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Electrical Characteristics (VDD=5V, TA=25oC, CI=1F, COUT=220F and RI=RF=20k unless otherwise specified. For SE Mode, HP_SENSE=5V, for BTL Mode, HP_SENSE=0V. ) Parameter Quiescent Current Shutdown Current HP_SENSE LOGIC Symbol IDD ISD VIH VIL VIH VIL 170 25 3 0.8 Conditions SE Mode, VIN=0, IO=0 BTL Mode, VIN=0, IO=0 VSHUTDOWN=5V 4 0.8 Min Typ 3 6 0.7 Max 10 mA 20 2.0 A V V V V oC oC AA4003 Unit SHUTDOWN LOGIC Thermal Shutdown Temperature Hysteresis Temperature Window SE Mode THD+N=1%, RL=32 Output Power PO THD+N=10%, RL=32 THD+N=1%, RL=16 THD+N=10%, RL=16 Total Harmonic Distortion + Noise Signal to Noise Ratio Crosstalk Power Supply Rejection Ratio BTL Mode Output Offset Voltage VOS VIN=0V, No load THD+N=1%, RL=4 Output Power PO THD+N=10%, RL=4 THD+N=1%, RL=8 THD+N=10%, RL=8 Total Harmonic Distortion + Noise Signal to Noise Ratio Crosstalk Power Supply Rejection Ratio THD+N PO=1W, RL=4, SNR XTALK PSRR PO=1W, RL=8, PO=1W, RL=8, f=1kHz Cb=1F, f=1KHz, VRIPPLE=0.2VRMS, RL=8 THD+N PO=75mW, RL=32, SNR XTALK PSRR PO=75mW, RL=32, PO=75mW, RL=32, f=1kHz Cb=1F, f=1KHz, VRIPPLE=0.2VRMS, RL=16 80 110 mW 160 220 0.2 90 -80 60 % dB dB dB 5 2 2.5 50 mV W 1.1 1.5 0.1 95 -80 67 % dB dB dB Oct. 2007 Rev. 1. 1 6 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Typical Performance Characteristics AA4003 Figure 3. Quiescent Current vs. Supply Voltage Figure 4. Quiescent Current vs. Ambient Temperature 10 10 1 VDD=5.0V, SE Mode f=1kHz, LPF=30kHz RL=16 RL=32 1 THD+N (%) 0.1 THD+N (%) VDD=5.0V, BTL Mode f=1kHz LPF=30kHz RL=4 RL=8 0.1 0.01 1E-3 10m 100m 300m 0.01 10m 100m 1 3 Output Power (W) Output Power (W) Figure 5. THD+N vs. Output Power @ SE Mode Figure 6. THD+N vs. Output Power @ BTL Mode Oct. 2007 Rev. 1. 1 7 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Typical Performance Characteristics AA4003 10 10 VDD=5.0V, SE Mode COUT=1000F, PO=150mW RL=16, LPF=80kHz THD+N (%) THD+N (%) 1 1 VDD=5.0V, BTL Mode PO=1.5W, RL=4 LPF=80kHz 0.1 0.1 0.01 20 100 1k 10k 20k 0.01 20 100 1k 10k 20k Frequency (Hz) Frequency (Hz) Figure 7. THD+N vs. Output Power @ SE Mode Figure 8. THD+N vs. Output Power @ BTL Mode 10 10 SE Mode, VDD=5.0V PO=75mW, RL=32 LPF=80kHz, COUT=1000F THD+N (%) THD+N (%) 1 1 BTL Mode, VDD=5.0V PO=1W, RL=8 LPF=80kHz 0.1 0.1 0.01 20 100 1k 10k 20k 0.01 20 100 1k 10k 20k Frequency (Hz) Frequency (Hz) Figure 9. THD+N vs. Frequency @ SE Mode Figure 10. THD+N vs. Frequency @ BTL Mode Oct. 2007 Rev. 1. 1 8 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Typical Performance Characteristics (Continued) AA4003 800 2.5 600 VDD=5.0V, SE Mode f=1kHz, LPF=30kHz THD+N=10% THD+N=1% 2.0 VDD=5.0V, BTL Mode f=1kHz, LPF=30kHz THD+N=10% THD+N=1% Output Power (mW) Output Power (W) 1.5 400 1.0 200 0.5 0 10 20 30 40 50 60 70 0.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 Resistor Load (ohm) Resistor Load () Figure 11. Output Power vs. Resistor Load @ SE Mode Figure 12. Output Power vs. Resistor Load @ BTL Mode 250 3.0 200 SE Mode, RL=16 f=1kHz, LPF=30kHz THD+N=10% THD+N=1% 2.5 BTL Mode, RL=4 f=1kHz, LPF=30kHz THD+N=10% THD+N=1% Output Power (mW) Output Power (mW) 3.0 3.5 4.0 4.5 5.0 2.0 150 1.5 100 1.0 50 0.5 0 2.5 0.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply Voltage (V) Supply Voltage (V) Figure 13. Output Power vs. Supply Voltage @ SE Mode Figure 14. Output Power vs. Supply Voltage @ BTL Mode Oct. 2007 Rev. 1. 1 9 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Typical Performance Characteristics (Continued) 70 75 AA4003 70 60 65 PSRR (dB) 50 PSRR (dB) 60 40 55 30 20 VDD=5.0V, SE Mode RL=32,Cb=1.0F VRIPPLE=0.2Vrms 50 45 VDD=5.0V, BTL Mode RL=8, Cb=1.0F VRIPPLE=0.2Vrms 40 10 10 100 1k 10k 20k 10 100 1k 10k 20k Frequency (Hz) Frequency (Hz) Figure 15. PSRR vs. Frequency @ SE Mode Figure 16. PSRR vs. Frequency @ BTL Mode 1000 4 -80 VDD=5.0V 800 0 Gain -4 -120 Start-up Time (ms) 600 -160 -8 400 Phase -12 -200 -240 200 -16 SE Mode, VDD=5.0V RF=RI=20k, COUT=1000F -280 100k 1M 10M 0 0.2 0.4 0.6 0.8 1.0 Bypass Capacitor (F) -20 10 100 1k 10k Frequency (Hz) Figure 17. Start-up Time vs. Bypass Capacitor Figure 18. Closed Loop Frequency Response Oct. 2007 Rev. 1. 1 10 BCD Semiconductor Manufacturing Limited Phase (deg) Gain (dB) Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Application Information _ COUT 220F + Left Out20k 20k _ + Left Out+ RPD 1.5k Main Speak AA4003 SE/BTL Mode, HP_SENSE Pin The AA4003 can operate under 2 types of output configuration, BTL (Bridged-Tied-Load) mode and SE (Single-Ended) mode, determined by HP_SENSE pin's logic level. (Here is the discussion about left channel only, it equally applies to right channel.) VDD + AMP1L Headphone Speak AMP2L R2 R1 100k 100k HP_SENSE= High Level _ + 20k Left Out20k _ + Left Out+ COUT 220F + RPD 1.5k Main Speak AMP1L AMP2L VDD R1 100k R2 100k HP_SENSE= Low Level SLEEVE HEADPHONE JACK Figure 19. Output Configuration for Left Channel in BTL Mode When HP_SENSE pin is held low which sets the chip in BTL mode, the AMP2L unit is turned on. AMP2L has fixed unity gain internally, AC signal at OUT+ is 180 degree phase shifted from OUT-. Because the DC component (Output Bias voltage, approx 1/2 VDD) between OUT+ and OUT- is canceled, there is no necessity to use DC block capacitors for main speak. In BTL mode, output voltage swing across main speaker is about 2 times that in SE mode, so there is 4 times output power compared to SE mode with same load and input. (see Figure 19) If applying high level to HP_SENSE pin which sets the chip in SE mode, the AMP2L unit is in high impedance state. There is no current loop between OUT+ and OUT-, the main speak is naturally disabled without any hardware change. The output audio signal rides on bias voltage at OUT- (Output Bias voltage, approx 1/2 VDD) , so it has to use a capacitor COUT to block DC bias and couple AC signal to headphone speak. (See Figure 20) It is recommended to connect HP_SENSE to the headphone jack switch pin illustrated in Figure 19. Oct. 2007 Rev. 1. 1 11 Figure 20. Output Configuration for Left Channel in SE Mode When headphone plug is not inserted, the voltage of HP_SENSE pin is determined by voltage divider formed by R1 and RPD. For given resistor's value in Figure 19, R1=100k, RPD=1.5k, DC voltage at HP_SENSE is about 74mV. AC signal equals output amplitude of OUT- through COUT, so signal at HP_SENSE node is 74mV DC plus AC signal. The maximum peak-to-peak voltage at OUT- is no greater than VDD (supply voltage 5.0V), so the positive maximum voltage of HP_SENSE node will be no greater than 2.5V+75mV2.575V, which is less than HP_SENSE input high level minimum value (4.0V). That means the chip is in BTL mode and there is no risk of operation mode switch between SE and BTL. When headphone plug is inserted, as the RPD is disconnected from R1, the voltage of HP_SENSE pin is pulled up by R1 to VDD and sets the chip in SE mode. HP_SENSE pin can also be connected to MCU I/O port to control the mode switch through MCU. It is necessary to note that AA4003 still can drive headphone even in BTL mode because OUT- is always active whatever the chip is in SE or BTL mode. CIN, COUT, Cb and CS (Power Supply) Selection For input stages of AA4003, input capacitors CI is used to accommodate different DC level between input source and AA4003 bias voltage (about 2.31V). Input capacitors CI and input resistors RI form a first order High Pass Filter, which determines the lower corner frequency according to the classic equation below, BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Application Information (Continued) AA4003 Example: VDD=5V, RL=8, BTL configuration, Desired output power PO=1.0W (each channel), THD+N 1%. Input signal, VIN=1.0VRMS from D-A converter. Step 1, To check if the chip can deliver 1W to 8 load with the limitation of THD+N 1%, VDD=5V. From Figure 6, Figure 12, AA4003 can deliver 1W to 8 load each channel. Step 2, If yes, to calculate output voltage, f CIL = 1 .............................................(1) 2RI C I Similarly, for output stage in SE mode, output capacitor (COUT), and headphone load also form a first order High Pass Filters, and its cut-off frequency is determined by equation 2. f COL = 1 ......................................(2) 2RHP COUT The purpose of bypass capacitor (Cb) is to filter internal noise, reduce harmonic distortion, and improve power supply rejection ratio performance. Tantalum or ceramic capacitor with low ESR is recommended, and it should be placed as close as possible to the chip in PCB layout. The chip will not work until internal DC bias is set up completely. So the size of Cb will also affect the chip start up time, which is approx linearly proportional to the value of bypass capacitor. For AA4003, here are various start-up times for several typical capacitor values. (see Figure 17) VOUT = P O R L = 1* 8 = 2.83VRMS So pass-band gain, AV=VOUT/VIN=2.83x. Step 3, Assuming input resistor is 20k, the feedback resistor=20k*1.415=28.3k.. Select the closest standard value 28k. Shutdown AA4003 has a shutdown feature to reduce power consumption. If apply high level to shutdown pin, output amplifiers will be turned off, bias circuit is also disabled, the maximum current drawn from VDD is less than 2.0A. A logic low level will enable the device. Optimizing CLICK/POP Noise The AA4003 includes optimized circuits to suppress CLICK/POP noise during power up/power down transition. In BTL mode the AA4003 can effectively reduce most common mode signal including CLICK/POP noise. In SE mode, optimized ramp for rise/fall edge of BIAS can significantly reduce click/pop noise due to charge and/or discharge output capacitor (COUT). Furthermore, increasing bypass capacitor value (Cb) can slower ramp of charging bypass capacitor, prolong start-up time, mask most of transient noises before bias voltage is set up completely. It is recommended to use 1.0F capacitor with lower ESR. Cb (F) 0.33 0.47 1.0 Start up Time (ms) 340 420 970 For AA4003 power supply, it is better to use an individual power source generated from voltage regulator split from video, digital circuit units in system. The power supply bypass capacitors, CS, is recommended to use one low ESR electrolytic capacitor between 4.7F to 10F with a parallel 0.1F ceramic capacitor which is located close to the chip. Setup Proper Gain, Design Example The closed loop gain of AA4003 is determined by the ratio of feedback resistor (RF) to input resistor (RI). AV = RF ........................................................(3) RI Oct. 2007 Rev. 1. 1 12 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Application Information (Continued) Power Dissipation, Efficiency and Thermal Design Consideration For Class AB amplifiers, Formula 4 is the basic equation of efficiency worked in BTL configuration, 2 AA4003 PDBTLMAX = 2VDD 2 x 52 = = 1.266W 2 RL 3.14 2 x 4 = VP 4VDD per channel, total power dissipation PDTOTAL=2* PDBTLMAX=2.53W. According to formula 6, maximum ambient temperature is, o TA = TJMAX - JA PDBTLMAX =150-50*2.53=23.5 C .......................................................(4) here VP is output peak voltage across the load. Thermal dissipation becomes major concern when delivering more output power especially in BTL mode. The maximum power dissipation can be calculated by following equation. That is to say, if user wants AA4003 to delivery 2W power per channel to 4 load at VDD=5.0V, BTL mode, ambient temperature has to hold lower than 23.5oC. When junction temperature exceeds about 170oC, OTSD feature will be enabled, and shutdown the device to limit total power dissipation. There is an exposed thermal pad on bottom of the chip to provide the direct thermal path from die to heat sink. It is recommended to use copper on the surface of Printed Circuit Board as heat sink. To dig some matrix regular holes under chip, remove mask of this area copper, and make sure to keep them contact well when soldering on PCB are also recommended. (See Figure 21) PDMAX = Here TJMAX - TA ......................................(5) JA TJMAX is maximum operating junction temperature, TA is ambient temperature, JA is thermal resistance from junction to ambient, which is 50oC/W for TSSOP-20 (EDP), given in datasheet. 150oC, Assuming TA is 25oC, the maximum power dissipation PDMAX is about 2.5W according to formula 6. There is an other formula about power dissipation which is determined by supply voltage and load resistance. PDBTLMAX 2V = 2DD ......................................(6) RL 2 Recommended PCB Layout for AA4003 Using wide traces for power supply to reduce power losses caused by parasitic resistance in all outputs is useful to help releasing heat away from the chip. It is recommended to place bypass capacitor, power supply bypass capacitors as close as possible to the chip. Figure 21 and Figure 22 show the recommended layout for double layer PCB. If power dissipation calculated in an application is larger than that package permitted, there will be a need to assemble an additional heat sink, or keep ambient temperature around the chip low, or increase load resistance, or decrease power supply voltage. Here is an example. Assuming VDD=5.0V, RL=4, stereo in BTL mode, Oct. 2007 Rev. 1. 1 13 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Application Information (Continued) AA4003 Figure 21. Copper and Holes under Part Figure 22. Top Route and Silk Screens Oct. 2007 Rev. 1. 1 14 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Typical Application RF AA4003 20k VDD 4,13 CI 1uF + CS 10F + RI 6 8 LINLIN+ _ + OUTL5 Left IN VDD 20k COUT RPD 220F 1.5k + 20k 16 HP-SENSE AMP1L 20k _ 100k 100k To control pin + OUTL+ 3 To HP-Sense circuit AMP2L 10 BYPASS CI 1F RI + Right IN 20k Cb 1.0F 11 9 RINRIN+ _ + OUTR12 COUT 220F + SLEEVE RPD 1.5k + 20k HEADPHONE JACK AMP1R 20k _ + OUTR+ 14 1 SHUTDOWN AMP2R 2,7,15 RF 20k Figure 23. Typical Application Circuit of AA4003 (M Package) Oct. 2007 Rev. 1. 1 15 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Mechanical Dimensions TSSOP-20(EDP) Unit: mm(inch) AA4003 6.400(0.252) 6.600(0.260) 4.100(0.161) 4.300(0.169) 2.900(0.114) 3.100(0.122) 4.300(0.169) 4.500(0.177) EXPOSED PAD 6.200(0.244) 6.600(0.260) 0.000(0.000) INDEX0.750(0.030)Dp 0.850(0.033) 0.100(0.004) #1 PIN 0.650(0.026)TYP 0.100(0.004) 0.190(0.007) 4-10 14 TOP & BOTTOM 0.200(0.008)MIN R0.090(0.004)MIN 0.900(0.035) 1.050(0.041) 0.340(0.013) 0.540(0.021) 1.200(0.047) MAX 0.050(0.002) R0.090(0.004)MIN 0.150(0.006) 0.250(0.010)TYP 0 8 0.200(0.008) 0.280(0.011) 0.450(0.018) 0.750(0.030) 1.000(0.039) REF Oct. 2007 Rev. 1. 1 16 BCD Semiconductor Manufacturing Limited Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Mechanical Dimensions (Continued) SOIC-16 Unit: mm(inch) AA4003 1.300(0.051) 1.000(0.039) 1.650(0.065) 7 0.700(0.028) 7 0.406(0.016) A 20:1 0.500(0.020) 0.600(0.024) 10.000(0.394) 2.000(0.079) Depth 0.060(0.002) 0.100(0.004) B 0.250(0.010) 1 5 R0.200(0.008) R0.200(0.008) 1.270(0.050) 6.040(0.238) 0.203(0.008) 0.150(0.006) 0.250(0.010) 0.250(0.010) 0.200(0.008)MIN C-C 50:1 3.940(0.155) 9.5 8 B 20:1 C 0.200(0.008) S 1.000(0.039) Depth 0.200(0.008) 3 7 8 8 A 0.400(0.016)x45 C Oct. 2007 Rev. 1. 1 17 BCD Semiconductor Manufacturing Limited 1.000(0.039) BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. MAIN SITE - Headquarters BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited - Wafer Fab No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Shanghai SIM-BCD Semiconductor Manufacturing Limited Tel: +86-21-24162266, Fax: +86-21-24162277 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 REGIONAL SALES OFFICE Shenzhen Office REGIONAL SALES OFFICE - Wafer Fab BCD Semiconductor Manufacturing Limited Shanghai Design Group - IC SIM-BCD Semiconductor Manufacturing Co., Ltd. 800 Yi Shan Road, Shanghai 200233, China Corporation Advanced Analog Circuits (Shanghai) Tel: +86-21-6485 900, Yi Shan Road, Shanghai 200233, China 8F, Zone B, 1491, Fax: +86-21-5450 0008 Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 USA Office BCD Semiconductor Corp. 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